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1 flip-chip bonding
монтаж методом переверненого кристалаEnglish-Ukrainian dictionary of microelectronics > flip-chip bonding
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2 flip-chip (bonding) technolog/y
технологія монтажу методом переверненого кристалаEnglish-Ukrainian dictionary of microelectronics > flip-chip (bonding) technolog/y
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3 flip-chip (bonding) technolog/y
технологія монтажу методом переверненого кристалаEnglish-Ukrainian dictionary of microelectronics > flip-chip (bonding) technolog/y
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4 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
5 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
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6 circuit
схема; коло; контур (див. т-ж chip, integration) - air-isolation integrated circuit
- all-diffused circuit
- aluminum-gate MOS circuit
- aluminum-gate circuit
- amplifier integrated circuit
- analog integrated circuit
- AND circuit
- AND-OR circuit
- application specific integrated circuit
- array integrated circuit
- asymmetric-chevron bubble circuit
- asymmetric-chevron circuit
- basic circuit
- beam-leaded integrated circuit
- beam-lead integrated circuit
- bipolar circuit
- bipolar-FET integrated circuit
- breadboard circuit
- built-in self-checking monitoring circuit
- bulk-effect integrated circuit
- catalogue integrated circuit
- ceramic-encapsulated integrated circuit
- charge-coupled device circuit
- charge-coupled circuit
- charge-domain integrated circuit
- charge pumping circuit
- charge-transfer device circuit
- charge-transfer circuit
- chip integrated circuit
- CMOS circuit
- commodity integrated circuit
- common-base circuit
- common-collector circuit
- common-emitter circuit
- compatible integrated circuit
- complementary integrated circuit
- complex integrated circuit
- control integrated circuit
- crosspoint integrated circuit
- current mirror integrated circuit
- custom integrated circuit
- customized integrated circuit
- custom-wired integrated circuit
- Darlington-typecircuit
- Darlingtoncircuit
- dead-on-arrival integrated circuit
- dedicated -design circuit
- dedicated circuit
- depletion-mode integrated circuit
- die integrated circuit
- dielectrically-isolated integrated circuit
- digital integrated circuit
- digital sequential circuit
- diode-array integrated circuit
- discrete-chip integrated circuit
- discrete-component circuit
- discrete Fourier transform integrated circuit
- discrete integrated circuit
- distributed-element equivalent circuit
- domain-originated integrated circuit
- dry-processed integrated circuit
- dual in-line integrated circuit
- ECL circuit
- EFL integrated circuit
- elevated-electrode integrated circuit
- encapsulated integrated circuit
- enchancement-mode integrated circuit
- epitaxial integrated circuit
- epitaxial passivated integrated circuit
- equivalent circuit
- face-down integrated circuit
- fanout-free circuit
- fault-free circuit
- fault-tolerant circuit
- faulty circuit
- field-effect transistor integrated circuit
- field-effect integrated circuit
- field-programmable logic integrated circuit
- film-mounted integrated circuit
- fine-line integrated circuit
- fine-pattern integrated circuit
- flat-pack integrated circuit
- flip-chip integrated circuit
- flip-flop circuit
- front-end circuit
- full-custom integrated circuit
- functional integrated circuit
- gang-bonding integrated circuit
- gate-equivalent circuit
- governor integrated circuit
- guard-ring isolated integrated circuit
- Gunn-effect integrated circuit
- heterointegrated circuit
- high-density integrated circuit
- highly integrated circuit
- high-performance circuit
- high-speed integrated circuit
- high-technology integrated circuit
- high-threshold logic circuit
- high-volume circuit
- home-grown integrated circuit
- homointegrated circuit
- hybrid circuit
- hybrid dielectric integrated circuit
- hybrid film [hybrid-type] circuit
- I2L circuit
- infra-red integrated circuit
- insulated-substrate integrated circuit
- integrated circuit
- interface circuit
- isoplanar-based integrated circuit
- Josephson-junctioncircuit
- Josephsoncircuit
- ion-implanted integrated circuit
- junction isolated integrated circuit
- known-good circuit
- ladder-like circuit
- ladder circuit
- laminated integrated circuit
- large-scale integrated circuit
- leading-edge integrated circuit
- linear integrated circuit
- LOCOS integrated circuit
- logic integrated circuit
- low-noise circuit
- low-profile integrated circuit
- LSI circuit
- lumped-element equivalent circuit
- made-to-order integrated circuit
- master-slice integrated circuit
- matrix integrated circuit
- megascale integrated circuit
- MOSBIP integrated circuit
- memory circuit
- merchant integrated circuit
- merged integrated circuit
- microelectronic circuit
- Micronor integrated circuit
- micron-scale integrated circuit
- microprocessor integrated circuit
- molecular integrated circuit
- monobrid circuit
- monolithic circuit
- MOS-transistor circuit
- MOS circuit
- MSI circuit
- multichip circuit
- multilayer integrated circuit
- multilevel integrated circuit
- multiple-chip circuit
- naked integrated circuit
- NAND circuit
- noise-immunity integrated circuit
- nonredundant integrated circuit
- NOR circuit
- off-the-shelf integrated circuit
- one-chip integrated circuit
- one-mask integrated circuit
- open-collector integrated circuit
- optical integrated circuit
- optoelectronic integrated circuit
- OR circuit
- oxide-isolated integrated circuit
- partially self-checking circuit
- photo-integrated circuit
- photonic integrated circuit
- planar integrated circuit
- planar-mounted integrated circuit
- plastic encapsulated integrated circuit
- plastic integrated circuit
- p-n junction isolated integrated circuit
- polymer thick-film circuit
- prediffused integrated circuit
- programmable integrated circuit
- proprietary integrated circuit
- quick Fourier transform circuit
- race-free circuit
- radiation-hardened integrated circuit
- RС circuit
- redundant integrated circuit
- refreshing circuit
- refresh circuit
- sample-hold circuit
- scaled integrated circuit
- scan design circuit
- schematic circuit
- Schottky TTL integrated circuit
- Schottky TTL circuit
- screen-printed integrated circuit
- sealed-junction integrated circuit
- self-aligned integrated circuit
- self-cased LSI circuit
- self-checking [self-testing] integrated circuit
- semiconductor circuit
- semicustom integrated circuit
- semicustomized integrated circuit
- S/H circuit
- single-chipcircuit
- singlecircuit
- skimming-and-reset circuit
- slice circuit
- small-integration circuit
- smart-power integrated circuit
- SOI integrated circuit
- solid-state integrated circuit
- solid integrated circuit
- SOS integrated circuit
- stacked circuit
- standard сеll-based semicustom integrated circuit
- Strassen algorithm LSI circuit
- stripline integrated circuit
- submicron integrated circuit
- subnanosecond integrated circuit
- superconducting integrated circuit
- superconductor integrated circuit
- surface-mounted integrated circuit
- test-manufactured integrated circuit
- thick-film hybrid integrated circuit
- thick-film integrated circuit
- thin-film hybrid integrated circuit
- thin-film integrated circuit
- three-diffusion integrated
- three-dimensional integrated circuit
- transistor circuit
- tri-mask integrated circuit
- UHSI circuit
- uncommitted integrated circuit
- unipolar integrated circuit
- user specified integrated circuit
- vacuum integrated circuit
- VHSI circuit
- VLSI circuit
- wafer-scale integrated circuit
- wired OR circuit
- 3D integrated circuit -
7 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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8 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder -
9 bump
стовпчиковий вивід, контактний стовпчик - external bump
- flip-chip bump
- gang-bonding bump
- plated bump
- solder bump
- sputtered gold bump -
10 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process
См. также в других словарях:
flip-chip bonding — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Flip-Chip-Montage — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
flip-chip mounting — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
inboard chip bonding — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Flip-Chip-Montage — Prozessor im Flip Chip Pin Grid Array Gehäuse Die Flip Chip Montage (dt. „Wende Montage“) ist ein Verfahren der Aufbau und Verbindungstechnik (AVT) zur Kontaktierung von ungehäusten Halbleiter Chips (engl. bare die) mittels Kontaktierhügel –… … Deutsch Wikipedia
Flip Chip — Die Flip Chip Montage (dt. „Wende Montage“) ist ein Verfahren der Aufbau und Verbindungstechnik (AVT) zur Kontaktierung von ungehäusten Halbleiter Chips (engl. bare die) mittels Kontaktierhügel − sogenannter „Bumps“. Bei der Flip Chip Montage… … Deutsch Wikipedia
Flip-Chip — Puce retournée Flip chip … Wikipédia en Français
Flip Chip — Puce retournée Flip chip … Wikipédia en Français
montage par méthode flip-chip — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Chip-On-Board-Technologie — Beispiel eines LCD Moduls, welches in COB Technologie ausgeführt ist Die Chip on Board Technologie (Abk.: COB, deutsch Nacktchipmontage) ist eine Technologie zur Direktmontage von ungehäusten Halbleiter Chips auf Leiterplatten zu einer… … Deutsch Wikipedia